製程能力表

項目/規格 S/S & D/S (單雙面) S/S & D/S (單雙面)
鑽孔 (Drill Ability) 最小孔徑:0.1mm 最小孔徑:0.15mm
備註-Remark 孔徑公差為+/-0.05mm
項目/規格 全面鍍 選鍍
鍍銅 (PTH Ability) 12~25um +/-2.5um 12~25um +/-2.5um
項目/規格 Normal Special
露光解析能力 - S/S (Min trace withh & spacing) 3mil/3mil (1/2oz) 2.5mil/2.5mil (1/2oz)
露光解析能力 - D/S (Min trace withh & spacing) 3mil/3mil (1/2oz) 2.5mil/2.5mil (1/3oz)
露光對位能力 (Exposure Tolerance) +/-0.15mm +/-0.1mm
蝕刻能力 (Etching Capability) +/-0.03mm (1/2oz以上) +/-0.02mm (1/3oz以下)
項目/規格 Normal Special
LPI解析能力 (顯影式防焊) 準確 (Min Solder dam) 5mil/5mil 4mil/4mil
LPI對位能力(防焊) (LPI Exposure Tolerance) +/-0.1mm +/-0.075mm
項目/規格 Normal Special
Cover-lay 偏移 Tol.(保護膠片) (Cover-lay migration tolerance) +/-0.3mm +/-0.2mm
Stiffener 偏移 Tol.(補強版) (Stiffener migration tolerance) +/-0.5mm +/-0.3mm
Adhesive 偏移 Tol.(背膠) (Adhesive migration tolerance) +/-0.5mm +/-0.3mm
備註-Remark 1. Cover-lay偏移公差小於+/-0.2mm時,建議使用LPI製程
2. Stiffener & Adhesive偏移公差小於+/-0.3mm時,須製作專用貼合治具貼合
項目/規格 Normal Special
文字線寬 (Silk line withh) 最小線寬:0.2mm 最小線寬:0.127mm
文字偏移 Tol.(Silk migration tolerance) +/-0.5mm +/-0.3mm
Solder Mask 偏移 Tol.(熱固型防焊) +/-0.5mm +/-0.3mm
AG 偏移 Tol. (銀漿)(AG migration tolerance) +/-0.5mm +/-0.3mm
Solder Mask厚度 (S/M Thickness) 8~20um
AG 厚度 (AG Thickness) 4~15um
項目/規格 表面處理 (Type Of Surface Finishing)
化學金 (Immersion Gold) Au:0.025um~0.2um (1~8u-inch) Ni:2~8um
電鍍硬金 (Hard Gold Electrop) Au:0.025um~0.75um (1~30u-inch) Ni:2~8um
電鍍軟金 (Soft Gold) Au:0.025um~0.75um (1~8u-inch) Ni:2~8um
化學錫 (Immersion Sn) 10~30u-inch
化學銀 (Immersion Ag) 5~12u-inch
電鍍錫 (Sn plating) 1.5~7.5um
OSP
項目/規格 木刀 蝕刻刀 (刀模) 鋼模
Normal Special Normal Special
外型尺寸 (Outline Dimension) +/-0.3mm +/-0.15mm +/-0.1mm +/-0.1mm +/-0.05mm
孔中心至邊 (Hole to Outline Edge) +/-0.2mm +/-0.15mm +/-0.1mm +/-0.1mm +/-0.07mm
孔至孔中心 (Hole to Hole) +/-0.2mm +/-0.15mm +/-0.1mm +/-0.1mm +/-0.07mm
第一PIN至板邊 (Pin to outline Edge) +/-0.2mm +/-0.15mm +/-0.1mm +/-0.1mm +/-0.07mm
下料孔 (Inner hole by Punch) 1.5mm 1.0mm 1.0mm 0.5mm
最小異形孔尺寸 (方形) (Min Square hole by Punch) 2.0*2.0mm 1.5*1.5mm 1.0*1.0mm 1.0*1.0mm 0.5*1.0mm
最小槽孔寬度 (Min Slot Withh) 2.0mm 1.5mm 1.0mm 1.0mm 0.5mm
備註-Remark 若板材厚度較厚或尺寸長度較長時,會因板材漲縮關係,而公差部份會有所調整…(厚度0.3mm,長度100mm 以上)
站別 項目 特殊規格(HDI)
底片 Film 1.繪制底片尺寸.Drawing film size 36X24"
2.繪制最小線寬/線距Draw the minimum line width / space 2/2mil
3.黑白,棕色 底片最大尺寸.Black and white, brown film the maximum size 黑片Black film36x24"
4.電腦輔助製造資料輸入格式.Computer-aided manufacturing data input format 274X 274D
5.電腦輔助製造資料輸出格式.Computer-aided manufacturing data output format 274X 274D
乾膜(內) Dry (inside) 1.最小線寬/線距Minimum line width / spacing 4mil
2.最小焊盤尺寸.Minimum pad size 孔徑Aperture+8 mil (0.2 mm)
3.導通孔錫環.Tin ring vias 3mil
4.非導通孔隔離Non-isolated vias 6mil
5.板厚最小到最大The smallest to the largest thickness 0.1~5.0mm
6.板面尺寸最小到最大.The smallest to the largest board size 520x620mm
7.銅厚Copper thickness h~5oz
8.最小板邊Minimum Edge 0.1mm
乾膜(外)Dry (outside) 1.最小線寬/線距Minimum line width / spacing 4/4mil
2.最小焊盤尺寸Minimum pad size BGA 8mil
3.板厚最小到最大The smallest to the largest thickness 0.4~5.0mm
4.板面尺寸最小到最大The smallest to the largest board size 520x620mm
5.導通孔錫環Tin ring vias 4mil(tenting)
6.蝕刻因子Etch Factor 0.3(YX)
鑽孔 Drilling 1.最小及最大鑽頭Minimum and maximum bit 0.15~6.4mm
2.最大板面尺寸Maximum board size 450x600mm
3.孔位公差Hole tolerance +/-3mil
4.成品板孔徑公差Finished plate diameter tolerance +/-3 mil
壓合 Lamination 1.最小及最大板厚Minimum and maximum thickness 0.3~5.0mm
2.最小工作板面尺寸Minimum board size of work 200x150mm
3.最大工作板面尺寸Maximum board size 520x620mm
防焊 Solder Mask 1.最小到最大板厚Minimum to the maximum thickness 0.2~3.2mm
2.板面尺寸Board Size 520x620mm
3.基材上防焊厚度最小到最大Substrate thickness on the solder minimum to maximum 0.4~2mil
4.銅面上防焊厚度最小到最大Solder thickness of the copper surface of the smallest to the largest 0.4~1.5mil
5.防焊錫墊尺寸比線路錫墊尺寸最少Anti-tin solder pad size pad size than the line at least 3mil
6.在錫墊間防焊最小寬度Tin solder between the minimum width of pad 3mil
7.在QFP間防焊最小寬度.QFP solder in between the minimum width 3mil
8.塞孔尺寸.Plug hole size 0.5mm
文字 Writing 1.最小文字尺寸(最小文字符號)Minimum text size (smallest text symbol) 5mil(線寬Line Width)20~26mm(高High)
2.文字與錫墊的間距The distance between text and tin pad 5mil
金手指斜邊 1.金手指斜邊角度Finger hypotenuse angle 20/30/45度
2.最小到最大板厚Minimum to the maximum thickness 0.8mm~2.0mm
ENTEK 1.最小到最大板厚Minimum to the maximum thickness 0.1~5.0mm
2.最小到最大單片尺寸Size of the smallest to the largest single 80~640mm
3.覆蓋厚度Cover thickness 0.2~0.4mm
可完成之表面處理Surface treatment can be completed 噴錫HAL YES
ENTEK
全面金Comprehensive chemical gold
化金Chemical King
化錫Chemical tin